Winbond Electronics Corporation
Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME? Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
 | W9825G6KH-6 TRIC DRAM 256MBIT PAR 54TSOP II | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：TSOPII-54 Packaging：Tape |  | |||
| W9464G6KH-5I TRIC DRAM 64MBIT PAR 66TSOP II | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：TSOPII-66 Packaging：Reel | | |||
| W25Q256JVBIQ TRIC FLSH 256MBIT SPI/QUAD 24TFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：TFBGA-24(6x8) Packaging：Reel | | |||
| W25Q40CLUXIG TRIC FLASH 4MBIT SPI 104MHZ 8USON | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：USON-8(2x3) Packaging：Tape | | |||
| W9812G6KH-5 TRIC DRAM 128MBIT PAR 54TSOP II | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：TSOPII-54 Packaging：Tape | | |||
| W25Q256JVFIM TRIC FLASH 256MBIT SPI/QUAD 16SOIC | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：SOIC-16 Packaging：Tape | | |||
| W631GU6MB11I TRIC DRAM 1GBIT PARALLEL 96VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-96(7.5x13) Packaging：Reel | | |||
| W631GG8MB12I TRIC DRAM 1GBIT PARALLEL 78VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-78(10.5x8) Packaging：Tape | | |||
| W25Q16JWZPIM TRIC FLASH 16MBIT SPI/QUAD 8WSON | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：WSON-8(6x5) Packaging：Reel | | |||
| W29N02GVBIAAIC FLASH 2GBIT PARALLEL 63FBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：FBGA-63(9x11.5) Packaging：Pallet | |
Manufacturers introduction
