Infineon Expands 1200V 62mm IGBT7 Line with New Modules

On August 4th, 2023, Infineon Technologies announced a breakthrough in electronic component technology. They unveiled an innovative product line featuring 62mm half-bridge and common-emitter module configurations, integrating the cutting-edge 1200 V TRENCHSTOP™ IGBT7 chip. These modules offer an impressive maximum current rating of up to 800 A, expanding Infineon's range of products that harness the proven 62mm packaging design.

This advancement empowers system designers by providing unparalleled flexibility for designing solutions that demand higher-rated currents. Not only does this innovation ensure adaptability, but it also delivers superior power density and enhanced electrical performance. The new module design caters to a wide range of applications, including solar inverters, industrial motor drives, uninterruptible power supplies (UPS), electric vehicle charging stations, energy storage systems (ESS), and other emerging industrial uses.

Built upon innovative micro-trench technology, the 62mm module series featuring the 1200 V TRENCHSTOP IGBT7 chip boasts significantly reduced static losses compared to modules with the IGBT4 chip. These improvements result in significantly lower operational losses, especially evident in industrial motor drives operating at medium switching frequencies. The IGBT's oscillation behavior and controllability have also been optimized, and the new power module can handle a maximum permissible junction temperature of 175°C.

With a sturdy nickel-plated copper baseplate and main terminals featuring nuts, the 62mm module packaging ensures ample mechanical strength. Positioned at the module's center, the main terminals are well-suited for parallel circuits and three-level topology configurations due to their low direct current loop inductance. The standardized packaging design and dimensions make this series compatible with previous module versions. Additionally, all modules are compatible with Infineon's validated pre-applied thermal interface materials (TIM), streamlining the assembly process and ensuring optimal performance.