iPhone 17 Pro to Feature A19 Pro Chip on TSMC 3nm N3P

Apple recently launched the iPhone 16 Pro, powered by the custom-designed 3nm A18 Pro chip. While performance improvements over the previous A17 Pro are minimal, expectations are high for next year's iPhone 17 Pro, which is set to include the more advanced A19 Pro chip, built on TSMC's enhanced 3nm architecture.

Renowned industry analyst Ming-Chi Kuo has confirmed that the iPhone 17 series will use processors manufactured with TSMC's N3P process—a refined version of the 3nm technology. Although earlier reports suggested Apple might transition to 2nm chips for the iPhone 17, it appears the company will continue utilizing 3nm chips for an extended period, with notable performance gains expected from the adoption of TSMC's N3P technology.

The difference between 2nm and 3nm chip technology lies in the transistor size and the underlying manufacturing process. Smaller transistors, measured in nanometers, allow for higher performance and efficiency. More transistors can fit within a single chip, enhancing its capability.

Kuo also shared insights on the iPhone 18 series, anticipated in 2026, revealing that only certain models will feature 2nm chips. Currently, the A18 Pro chip in the iPhone 16 Pro is built using TSMC's N3E (second-generation 3nm) process, which focuses on improving energy efficiency and production yields—a strategic choice for Apple this year. In contrast, the N3P process used in next year's iPhone 17 Pro is expected to offer significant performance boosts without sacrificing efficiency.

However, due to the complexity of the N3P manufacturing process, chip production yields may be lower than those of the N3E-based 3nm chips, potentially increasing the overall cost. This cost may ultimately be passed on to consumers.

While the iPhone 17 series is expected to benefit from substantial performance improvements with N3P technology, the spotlight for the iPhone 18 series will likely shift to the breakthrough 2nm chips.