iPhone 18 A20 Chip to Use TSMC 2nm and WMCM Packaging

Reports indicate that Apple's iPhone 17 series will continue utilizing TSMC's 3nm process, with a shift to the new "N3P" variant. This decision means that the A19 and A19 Pro chips, expected next year, will not transition to 2nm technology. However, by 2026, with the launch of the iPhone 18 series, Apple is anticipated to introduce the A20 and A20 Pro chips, which will employ advanced lithography and transition from the current InFo (Integrated Fan-Out) packaging to a new WMCM (Wafer-Level Multi-Chip Module) design. This shift will enable the development of more sophisticated components within a single chip.

One of the reasons for delaying the 2nm process for the iPhone 17 is the high wafer cost, which suggests that the 2nm node may be reserved for select models of the iPhone 18 series. According to industry sources, the A20 and A20 Pro chips, expected to debut two years from now, will not only leverage TSMC's 2nm technology but also incorporate WMCM packaging, allowing for an upgrade to 12GB of memory.

The current generation A18 and A18 Pro chips use TSMC's InFo packaging, which integrates components within a single package. This approach optimizes performance and size by placing DRAM memory close to the main SoC (System-on-Chip), typically on top of or near the CPU and GPU chips. The new WMCM packaging, on the other hand, will enable Apple to integrate multiple chips into a single package, combining the CPU, GPU, DRAM, and neural engines.

WMCM packaging also offers Apple greater flexibility in chip layout, allowing for either vertical stacking or side-by-side placement of chips. This design can help scale chip performance based on the device category. Additionally, Apple is expected to use the 2nm process for developing the M6 chip, with the WMCM technology paving the way for more powerful versions, such as the M6 Ultra.