TSMC 2nm Wafer Fab in Kaohsiung Nears Completion

According to supply chain sources, TSMC's first 2nm wafer fabrication facility in Kaohsiung is set to be completed soon. An inauguration ceremony is scheduled for November 26, followed by equipment installation starting December 1. TSMC has confirmed that the Kaohsiung wafer plant, announced in November 2021, broke ground in 2022 and is currently progressing well, with public infrastructure already established.

The company emphasizes that the development of 2nm process technology is on track, with performance and yield meeting expectations—some metrics even exceeding initial projections. Mass production of the 2nm process is anticipated to begin as scheduled in 2025, with production curves expected to be similar to the 3nm process.

Insiders report that TSMC's 2nm manufacturing operations will take place at the Baoshan F20 plant in Hsinchu Science Park and the Nanzi F22 plant in Kaohsiung. The Baoshan facility aims to complete a mini production line by the end of this year, with production slated to commence in the fourth quarter of 2025, targeting a monthly output of approximately 30,000 wafers. Meanwhile, the Nanzi facility is projected to start commercial production in the first quarter of 2026, also with a monthly capacity of 30,000 wafers.

TSMC's Chairman and CEO, C.C. Wei, has expressed strong confidence in the unprecedented demand for 2nm technology, noting that planned capacity for this process has already surpassed that of the 3nm process.

Importantly, sources within the semiconductor industry reveal that TSMC has validated the blueprints for 2nm products with clients and has offered processing quotes exceeding $30,000.