Intel Launches Production with First High NA EUV Machines

Intel has announced that the first two cutting-edge extreme ultraviolet (EUV) lithography machines from ASML have begun production at its facilities, marking a significant step in its chip manufacturing capabilities. Early data suggests that these new systems offer improved reliability compared to previous models.

During a conference held in San Jose, California, Intel's Senior Chief Engineer, Steve Carson, shared that the company has successfully used ASML's High Numerical Aperture (High NA) EUV lithography machines to produce 30,000 wafers in a single quarter. These large silicon wafers can be used to manufacture thousands of computing chips.

In 2024, Intel became the first semiconductor manufacturer to receive these advanced lithography tools, with the expectation that they will enable the production of smaller, faster computing chips compared to earlier ASML machines. This move represents a strategic shift for Intel, as the company has historically lagged behind competitors in adopting next-generation EUV technology.

Each High NA EUV machine is priced around $350 million, significantly higher than the $180 million to $200 million cost of ASML's standard EUV systems.

It took Intel seven years to fully integrate these new machines into production, a delay that resulted in the company losing its competitive edge to Taiwan Semiconductor Manufacturing Company (TSMC). In earlier stages of EUV production, Intel faced challenges with the reliability of the previous generation equipment.

However, Steve Carson emphasized that early testing of the High NA EUV machines has shown they are approximately twice as reliable as the previous generation. “We are producing wafers at a stable pace, which brings significant benefits to the platform,” Carson said.

The new ASML EUV machines utilize advanced beams to imprint features onto chips, enabling the same work to be completed with fewer exposures. This leads to savings in both time and cost. Carson noted that the initial results from Intel's facilities show that the High NA EUV machines require only one exposure and a handful of processing steps, compared to the previous generation's need for three exposures and around 40 processing steps.

Intel also plans to leverage the High NA EUV equipment to help develop its Intel 18A (1.8nm) manufacturing process, which is scheduled to begin production later this year alongside next-generation PC chips. The company further intends to fully integrate the High NA EUV systems into the development of its Intel 14A (1.4nm) manufacturing process, although the mass production timeline for this technology remains undisclosed.