Xiaomi's 3nm Chip Xring O1 Enters Mass Production

On May 20, Xiaomi Chairman Lei Jun announced that the company's in-house developed 3nm flagship chip has officially entered mass production. The chip, named Xring O1 (玄戒O1), is set to debut in two upcoming premium devices: the Xiaomi 15s Pro flagship smartphone and the Xiaomi Pad 7 Ultra, a high-end OLED tablet.

Xring O1 is manufactured using a second-generation 3nm process node, aiming to deliver a top-tier user experience and performance benchmark in the flagship category. Lei Jun revealed that this next-generation System-on-Chip (SoC) will be officially launched on the evening of May 22 during Xiaomi's strategic product launch event.

This marks Xiaomi's return to mobile SoC development after an 8-year hiatus. The last custom chip from the company, the Surge S1, was unveiled in 2017. Following setbacks, Xiaomi had shifted focus to smaller, specialized chips—introducing a series of innovations such as fast-charging controllers, battery management ICs, image processors, and antenna enhancement chips. These developments gradually built Xiaomi's semiconductor expertise across various technology domains.

In early 2021, Xiaomi made the strategic decision to reignite its large-scale SoC development efforts. According to public business registration data, Shanghai Xring Technology Co., Ltd. was established in December 2021 with an initial registered capital of 1.5 billion RMB, later increased to 1.92 billion RMB in June 2023. In October 2023, Beijing Xring Technology Co., Ltd. was founded with a registered capital of 3 billion RMB. Both entities are led by Adam Zeng (Zeng Xuezhong), Senior Vice President of Xiaomi Group and President of its International Business Department.

Xring O1 is expected to become a milestone in China's advanced chip design landscape, positioning Xiaomi as a serious contender in the custom SoC race at the 3nm level.