Samsung Electronics to Introduce Glass Interposers by 2028

Industry sources have revealed on May 25 that Samsung Electronics has confirmed its strategic plan to adopt glass interposers in the field of advanced semiconductor packaging by 2028. This move marks the first official acknowledgment of Samsung's glass substrate roadmap, replacing the traditional silicon interposers with glass-based solutions.

An insider stated, “Samsung Electronics is preparing to transition from silicon to glass interposers by 2028 to better meet evolving customer requirements.”

Interposers, also known as intermediate substrates, play a critical role in AI chip architecture. Advanced AI semiconductors utilize a 2.5D packaging structure where the graphics processing unit (GPU) is centrally positioned, surrounded by high-bandwidth memory (HBM). The interposer serves as the essential connection channel between the GPU and HBM.

Currently, interposers are predominantly silicon-based. However, the industry is actively exploring glass as a replacement material for both interposers and motherboards, with the shift towards glass expected to accelerate faster in interposer applications. For example, AMD has announced plans to implement glass interposers in its semiconductor products by 2028.

It has been confirmed that Samsung Electronics is engaging with partners to incorporate glass interposers customized to chip sizes in “unit” formats.

Additionally, Samsung is reportedly focusing on implementing this technology on glass substrates smaller than 100×100 mm. Experts suggest this approach is a strategic decision aimed at accelerating the technology's development cycle and prototype production, facilitating quicker market entry. However, due to the smaller substrate size, the production efficiency during mass manufacturing may be relatively limited.