
According to Wccftech, Intel is now ready to open its most advanced Intel 14A process node to a wider range of external clients. Analysts at GF Securities Hong Kong indicate that NVIDIA and AMD plan to leverage this process for their next-generation server CPUs. Earlier reports also suggested that Intel may have secured orders to manufacture AI server chips for Apple.
Since Intel CEO Pat Gelsinger took charge earlier this year, the company has shifted focus from promoting the Intel 18A process to prioritizing Intel 14A, concentrating engineering resources, design partners, and new client collaborations on the more advanced node. Intel 14A is being redeveloped with key client needs in mind.
Intel has previously disclosed that 14A delivers a 15-20% performance-per-watt improvement, 30% higher density, and 25-35% lower power consumption compared to 18A. Both 14A and its evolution 14A-E will adopt second-generation RibbonFET gate-all-around (GAA) transistors and the new PowerDirect direct-contact power delivery technology, while utilizing High-NA EUV lithography for production (18A uses PowerVia back-side power delivery).
Recently, Intel announced the installation of ASML's second-generation High-NA EUV lithography system, the TWINSCAN EXE:5200B, at its cutting-edge fabs. This equipment is currently the most advanced lithography tool worldwide and will be used for mass production of the 14A node.
Intel first received a High-NA EUV machine (TWINSCAN EXE:5000) from ASML at the end of 2023 and installed it at the D1X fab in Oregon in early 2024 for trial operations. This fab has since become a research hub for developing advanced processes based on High-NA EUV technology. The EXE:5200B machine can process 175 wafers per hour under standard conditions, with Intel targeting over 200 wafers per hour. Experience gained from the past year has improved overlay accuracy to 0.7 nm.
With its combination of cutting-edge technology, performance improvements, and higher production efficiency, Intel 14A could surpass TSMC's A16 node, which is only beginning to introduce back-side power delivery while still relying on standard EUV lithography—making Intel 14A a compelling choice for external clients.
Meanwhile, Intel's 18A-based Panther Lake is on track for large-scale production and will debut at CES on January 5, 2026. GF Securities Hong Kong notes that the 18A yield reached 60-65% in November this year, with plans to hit 70% by the end of 2025.