SK Hynix to Double 1c DRAM Output by 2027

According to industry reports, SK Hynix is accelerating production of its 1c DRAM to capture surging demand for both 1c DRAM and high-bandwidth memory (HBM4). The company plans to double its initially projected output from last year, focusing more resources on this high-demand product despite limited overall wafer capacity.

1c DRAM is versatile: it can be sold directly to consumer markets or used as a key component in high-bandwidth memory, making it critical for next-generation applications. SK Hynix has already engaged with multiple equipment partners to support its expanded production plans. By early 2027, the company aims to increase monthly 1c DRAM wafer output to 170,000–200,000 wafers, compared to last year's plan of just 90,000 wafers, highlighting a significant ramp-up.

Throughout 2025, SK Hynix repeatedly revised its 1c DRAM capacity targets upward. Monthly output was first increased to 122,000 wafers in August and then to 150,000 wafers by October. Looking further ahead, the company targets 270,000 wafers per month by the end of 2028.

In terms of production layout, SK Hynix plans to convert its M16 plant's 1a DRAM lines to 1c DRAM next year, along with a 1b DRAM line, to meet growing demand. Competitor Micron expects 1c DRAM to be a major driver of operational growth this year.

Market expectations indicate that SK Hynix has secured roughly 70% of NVIDIA's HBM4 orders, maintaining its position as the largest global supplier. The company is also the sole provider of HBM3E memory for Microsoft's Maia 200 AI chips, reinforcing its leadership in the high-end memory segment.