MediaTek Dimensity SoC May Tap Intel 14A

According to reports, Intel's foundry business appears to have secured another high-profile external customer. According to a report from overseas tech media wccftech, MediaTek is rumored to be considering Intel's 14A process for future Dimensity mobile SoCs, a move that could signal growing confidence in Intel's advanced manufacturing roadmap.

Bringing a complex smartphone processor to Intel 14A will not be straightforward. Intel has introduced backside power delivery technology in both its 18A and 14A nodes. This design feeds power through shorter and thicker metal paths on the back of the wafer, which can improve performance, reduce voltage drop, and enable higher and more stable operating frequencies. It also frees up routing space on the front side, helping increase transistor density and ease congestion. Yet the benefits are not without trade-offs. If not carefully managed, the approach may intensify the self-heating effect inside the chip, potentially requiring additional cooling solutions. Intel is believed to be working on new engineering methods to mitigate these thermal challenges.

Even with these hurdles, winning MediaTek would be a major milestone for Intel. Producing Dimensity SoCs on 14A could open the door to more design wins and strengthen the credibility of Intel Foundry as an alternative advanced node provider. For now, however, the story remains unconfirmed and should be viewed with caution until both companies offer clearer signals.

Interest in Intel's latest processes has been building. Earlier reports suggested that Apple may adopt Intel 18A-P technology for an entry-level M-series chip planned for 2027 and for a standard iPhone A-series processor expected in 2028. Analysts have also noted that Apple is preparing a custom server-oriented ASIC for release around 2028, which could take advantage of Intel's EMIB advanced packaging platform.

The most recent updates indicate that Apple has signed a confidentiality agreement with Intel and obtained a process design kit for the 18A-P node to begin technical evaluation. Intel 18A-P is the company's first process to support Foveros Direct 3D hybrid bonding, enabling multiple chiplets to be stacked vertically through TSV connections. If these collaborations progress, they could mark a turning point for Intel's return to the leading edge of semiconductor manufacturing.