TSMC to Build New 3nm Fab in Tainan

According to TSMC Chairman and CEO C.C. Wei, Taiwan Semiconductor Manufacturing Company (TSMC) plans to build an additional 3nm wafer fabrication plant in Tainan, Taiwan, China, with mass production expected to begin in the first half of 2028. The decision comes as TSMC continues to expand its manufacturing capacity in Taiwan, China, while evaluating the possibility of establishing a new fabrication plant in Texas, United States. In addition to its existing plans to build one new 3nm facility each in Taiwan, China, the United States, and Japan, the latest expansion would bring the total number of planned new facilities to four.

Wei explained that TSMC has traditionally avoided adding manufacturing capacity once a process technology node reaches its target production scale. However, the company expects demand for its 3nm process technology to remain strong for several years. After evaluating long-term customer demand, TSMC decided to add another fabrication plant in Tainan while continuing its global expansion to provide additional production capacity and better support customer requirements.

The additional investment reflects TSMC's expectations for sustained demand for 3nm semiconductor manufacturing technology. As advanced process nodes remain essential to the development of high-performance computing, artificial intelligence, and other next-generation applications, the expansion is expected to strengthen TSMC's manufacturing capacity and its ability to meet customers' evolving needs.