Transform a 72mm x 24mm wireless receiver into a portable 47 headphone amp with our DIY guide, including necessary modifications and components.

Infineon introduces the world's first 12-inch GaN wafer technology, set to revolutionize power semiconductors for AI data centers and electric vehicles.

SMYG LIMITED will have a three-day Mid-Autumn Festival holiday from September 15th to 17th, make up the missing day on September 14th, and will resume work on September 18th.

Google is rumored to switch from Samsung to TSMC for its Tensor G6 chip, using TSMC's 2nm technology, while the Tensor G5 will feature 3nm process technology.

Discover the TI TPS25940AQRVCRQ1 Hot Swap Controller: key features, specifications, datasheet, and applications in automotive and power management. Learn more here.

Discover Through Hole Resistors—traditional components used in electronics for their durability, ease of repair, and high power handling in various applications.

SK Hynix introduces the PEB110, a high-performance SSD for data centers with PCIe Gen5, doubling performance and boosting energy efficiency by 30%.

Transform your Xiaomi power bank with a Type-C port and custom case for a more convenient, pocket-friendly charger.

TSMC's August revenue rose by 33% to NT$250.9 billion, driven by strong AI chip demand and high-performance computing growth, with Apple and Nvidia leading the market.

AMD announces its unified UDNA GPU architecture at IFA 2024, aiming to simplify development and challenge NVIDIA’s CUDA ecosystem in AI and high-performance computing.