Global Fan-Out Packaging Market Predicted to Double in Size by 2028, Led by Dominant Player TSMC
The FO market, an advanced packaging technology, is expected to double in size within the next five years due to increased demand across industries, led by TSMC, which currently holds a 76.7% market share, according to a report by Yole Intelligence.
smbom 2023-03-31 13:22:23