Winbond Electronics Corporation
Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME? Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
 | W948D6KBHX5EIC DRAM 256MBIT PARALLEL 60VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-60(8x9) Packaging：Pallet |  | |||
 | W9725G6KB25IIC DRAM 256MBIT PARALLEL 84WBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：WBGA-84(8x12.5) Packaging：Tube | | |||
 | W25Q128JVCIMIC FLSH 128MBIT SPI/QUAD 24TFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：TFBGA-24(6x8) Packaging：Pallet | | |||
 | W9751G6NB25I TRIC DRAM 512MBIT PARALLEL 84VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-84(8x12.5) Packaging：Tape | | |||
| W9425G6KH-5IIC DRAM 256MBIT PAR 66TSOP II | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：TSOPII-66 Packaging：Pallet | | |||
| W25Q256JVCIMIC FLSH 256MBIT SPI/QUAD 24TFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：TFBGA-24(6x8) Packaging：Tray | | |||
| W632GG8NB15IIC DRAM 2GBIT PARALLEL 78VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-78(8x10.5) Packaging：Tray | | |||
| W632GG6NB15IIC DRAM 2GBIT PARALLEL 96VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-96(7.5x13) Packaging：Tray | | |||
| W25M02GVTCIT TRIC FLSH 2GBIT SPI 104MHZ 24TFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：TFBGA-24(6x8) Packaging：Tape | | |||
| W25R128JVPIQ TRIC FLASH 128MBIT SPI/QUAD 8WSON | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：WSON-8(6x5) Packaging：Tape | |
Manufacturers introduction
