Winbond Electronics Corporation
Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME? Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
 | W25X40CLSVIGIC FLASH 4MBIT SPI 104MHZ 8VSOP | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：VSOP-8 Packaging：Tube |  | |||
| W9812G6KH-5IC DRAM 128MBIT PAR 54TSOP II | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：TSOPII-54 Packaging：Pallet | | |||
| W631GU6MB-11IC DRAM 1GBIT PARALLEL 96VFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：VFBGA-96(7.5x13) Packaging：Tray | | |||
| W9412G6KH-5IIC DRAM 128MBIT PAR 66TSOP II | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：TSOPII-66 Packaging：Pallet | | |||
| W631GG6MB12IIC DRAM 1GBIT PARALLEL 96VFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：VFBGA-96(7.5x13) Packaging：Pallet | | |||
| W947D2HBJX5EIC DRAM 128MBIT PARALLEL 90VFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：VFBGA-90(8x13) Packaging：Pallet | | |||
| W94AD6KBHX5EIC DRAM 1GBIT PARALLEL 60VFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：VFBGA-60(8x9) Packaging：Pallet | | |||
| W9812G6JB-6IIC DRAM 128MBIT PARALLEL 54TFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：TFBGA-54(8x8) Packaging：Pallet | | |||
| W25Q20EWBYIG TRIC FLASH 2MBIT SPI/QUAD 8WLCSP | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：WLCSP-8(1.4x1.34) Packaging：Tape | | |||
| W949D6DBHX5EIC DRAM 512MBIT PARALLEL 60VFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：VFBGA-60(8x9) Packaging：Pallet | |
Manufacturers introduction
