Winbond Electronics Corporation
Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME? Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
 | W632GU6NB-15IC DRAM 2GBIT PARALLEL 96VFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：VFBGA-96(7.5x13) Packaging：Pallet |  | |||
| W25Q128FWFIGIC FLASH 128MBIT SPI/QUAD 16SOIC | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：SOIC-16 Packaging：Tube | | |||
| W9825G6JB-6 TRIC DRAM 256MBIT PARALLEL 54TFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：TFBGA-54(8x8) Packaging：Reel | | |||
| W25M02GVTBIT TRIC FLSH 2GBIT SPI 104MHZ 24TFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：TFBGA-24(6x8) Packaging：Tape | | |||
| W972GG6KB-18 TRIC DRAM 2GBIT PARALLEL 84WBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：WBGA-84(8x12.5) Packaging：Reel | | |||
| W631GU8MB11I TRIC DRAM 1GBIT PARALLEL 78VFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：VFBGA-78(10.5x8) Packaging：Reel | | |||
| W631GG8MB15I TRIC DRAM 1GBIT PARALLEL 78VFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：VFBGA-78(10.5x8) Packaging：Reel | | |||
| W948D2FBJX5I TR W948D2FBJX5I TR | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：VFBGA-90(8x13) Packaging：Tape | | |||
| W9464G6KH-5IC DRAM 64MBIT PAR 66TSOP II | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：TSOPII-66 Packaging：Pallet | | |||
| W25Q64JVTCIQIC FLASH 64MBIT SPI/QUAD 24TFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：TFBGA-24(6x8) Packaging：Pallet | |
Manufacturers introduction
