Winbond Electronics Corporation
Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME? Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
 | W948D2FBJX5EIC DRAM 256MBIT PARALLEL 90VFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：VFBGA-90(8x13) Packaging：Pallet |  | |||
| W25Q40CLSNIGIC FLASH 4MBIT SPI 104MHZ 8SOIC | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：SOIC-8 Packaging：Tube | | |||
| W25Q20EWSNIGIC FLASH 2MBIT SPI 104MHZ 8SOIC | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：SOIC-8 Packaging：Tray | | |||
| W978H6KBVX2IIC DRAM 256MBIT PAR 134VFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：VFBGA-134(10x11.5) Packaging：Pallet | | |||
| W25Q512JVBIMIC FLSH 512MBIT SPI/QUAD 24TFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：TFBGA-24(6x8) Packaging：Pallet | | |||
| W25Q32JVTCIQIC FLASH 32MBIT SPI/QUAD 24TFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：TFBGA-24(6x8) Packaging：Pallet | | |||
| W25Q32JWSSIQIC FLASH 32MBIT SPI/QUAD 8SOIC | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：SOIC-8 Packaging：Tube | | |||
| W9816G6JH-5IC DRAM 16MBIT PAR 50TSOP II | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：TSOPII-50 Packaging：Tray | | |||
| W9864G6KH-5IC DRAM 64MBIT PAR 54TSOP II | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：TSOPII-54 Packaging：Pallet | | |||
| W631GG8MB-15IC DRAM 1GBIT PARALLEL 78VFBGA | Category：Pre-ordered Chips Manufacturer：Winbond Electronics Corporation Package：VFBGA-78(10.5x8) Packaging：Tray | |
Manufacturers introduction
