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Winbond Electronics Corporation
Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME? Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
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W632GG8NB09IIC DRAM 2GBIT PARALLEL 78VFBGA
Category:Pre-ordered Chips
Manufacturer:WINBOND(华邦)
Package:VFBGA-78(8x10.5)
Packaging:Pallet
W29N04GVBIAA VFBGA-63(9x11) NAND FLASH ROHS
Category:Pre-ordered Chips
Manufacturer:WINBOND(华邦)
Package:VFBGA-63(9x11)
Packaging:Tray
W632GU6NB-09IC DRAM 2GBIT PARALLEL 96VFBGA
Category:Pre-ordered Chips
Manufacturer:WINBOND(华邦)
Package:VFBGA-96(7.5x13)
Packaging:Pallet
W948D2FBJX6EIC DRAM 256MBIT PARALLEL 90VFBGA
Category:Pre-ordered Chips
Manufacturer:WINBOND(华邦)
Package:VFBGA-90(8x13)
Packaging:Tray
W632GU8NB11IIC DRAM 2GBIT PARALLEL 78VFBGA
Category:Pre-ordered Chips
Manufacturer:WINBOND(华邦)
Package:VFBGA-78(8x10.5)
Packaging:Tray
W9864G6KH-6 TR W9864G6KH-6 TR
Category:Pre-ordered Chips
Manufacturer:WINBOND(华邦)
Package:TSOPII-54
Packaging:Tape
W948D2FBJX5I TR W948D2FBJX5I TR
Category:Pre-ordered Chips
Manufacturer:WINBOND(华邦)
Package:VFBGA-90(8x13)
Packaging:Tape
W9812G6JB-6I TR W9812G6JB-6I TR
Category:Pre-ordered Chips
Manufacturer:WINBOND(华邦)
Package:TFBGA-54(8x8)
Packaging:Tape
W25Q257JVFIQ TR W25Q257JVFIQ TR
Category:Pre-ordered Chips
Manufacturer:WINBOND(华邦)
Package:SOIC-16
Packaging:Tape
W631GU8MB15I TRIC DRAM 1GBIT PARALLEL 78VFBGA
Category:Pre-ordered Chips
Manufacturer:WINBOND(华邦)
Package:VFBGA-78(10.5x8)
Packaging:Tape
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