Winbond Electronics Corporation
Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME? Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
 | W988D2FBJX6I TRIC DRAM 256MBIT PARALLEL 90VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-90(8x13) Packaging：Reel |  | |||
| W25Q128JVEIM TRIC FLASH 128MBIT SPI/QUAD 8WSON | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：WSON-8(8x6) Packaging：Tape | | |||
| W25Q80EWZPIG TRIC FLASH 8MBIT SPI 104MHZ 8WSON | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：WSON-8(6x5) Packaging：Reel | | |||
| W9751G6NB-25 TRIC DRAM 512MBIT PARALLEL 84VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-84(8x12.5) Packaging：Tape | | |||
| W632GU6NB-12 TRIC DRAM 2GBIT PARALLEL 96VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-96(7.5x13) Packaging：Tape | | |||
| W631GG6MB15IIC DRAM 1GBIT PARALLEL 96VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-96(7.5x13) Packaging：Pallet | | |||
| W25Q80EWSSIGIC FLASH 8MBIT SPI 104MHZ 8SOIC | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：SOIC-8 Packaging：Tube | | |||
| W25Q32JVSTIQIC FLASH 32MBIT SPI/QUAD 8VSOP | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VSOP-8 Packaging：Pallet | | |||
| W25Q128JVPIMIC FLASH 128MBIT SPI/QUAD 8WSON | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：WSON-8(6x5) Packaging：Tube | | |||
| W9464G6KH-5IIC DRAM 64MBIT PAR 66TSOP II | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：TSOPII-66 Packaging：Tray | |
Manufacturers introduction
