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24LC64-I/SN: Features, Specs & More
Explore the Microchip 24LC64-I/SN EEPROM memory with its features, specifications, applications, and manufacturer details for electronics design.
smbom 2026-08-11 14:58:52
DIY Power Bank with IP5318 & QC3.0
DIY power bank with an IP5318 controller, QC3.0 fast charging support, and reused lithium batteries. A simple battery pack project guide.
smbom 2026-08-11 14:16:07
How to Increase Transformer Capacity?
Learn how to increase transformer capacity, including expansion steps, capacity calculation, equipment selection, and key considerations for three-phase power systems.
smbom 2026-08-11 13:48:20
TSMC July Revenue Surges 44.7% YoY
TSMC’s July revenue surged 44.7% year over year to a record high, driven by AI chip demand and strong growth in advanced semiconductor processes.
smbom 2026-08-11 13:07:40
Samsung HBM4 Yield Surpasses 80%
Samsung HBM4 mass-production yield exceeds 80%, accelerating AI memory expansion and strengthening competition with SK hynix in the HBM market.
smbom 2026-08-11 11:34:57
Sony, TSMC Plan $6.3B Next-Gen Image Sensor Project
Sony and TSMC plan a $6.3B investment to build next-generation image sensor production lines in Japan, targeting mass production by 2029.
smbom 2026-08-11 11:09:23
24LC512-E/SN: Features, Specs & More
Explore the Microchip 24LC512-E/SN EEPROM memory, including features, specifications, applications, and manufacturer details for electronics design.
smbom 2026-08-10 14:52:03
DIY Smart Temperature Control for WG3526 Router
DIY smart temperature control system for a WG3526 router with a temperature controller and fan to reduce overheating and improve WiFi stability.
smbom 2026-08-10 14:17:15
Are Transformer Primary and Secondary Windings Synchronized?
Learn whether transformer primary and secondary windings change synchronously, including working principles, influencing factors, and ways to improve synchronization.
smbom 2026-08-10 13:43:13
TSMC Eyes AUO Plants for Advanced Packaging
TSMC is reportedly negotiating to acquire two AUO panel factories in Taiwan to expand advanced packaging capacity and support next-generation AI chip packaging.
smbom 2026-08-10 13:14:51
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