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How Can Transformer Leakage Inductance Be Reduced?
Learn how to reduce transformer leakage inductance through optimized winding structures, magnetic circuits, core design, shielding, and operating parameters.
smbom 2026-08-13 15:00:10
CoreWeave Warns of Challenges Without Nvidia Chips
CoreWeave warns that moving away from Nvidia GPUs could require significant time and resources and affect its ability to meet customer AI computing needs.
smbom 2026-08-13 13:24:20
Samsung Delays High-NA EUV for 1nm
Samsung delays High-NA EUV adoption until its 1nm A10 process, targeting mass production around 2030 after 1.4nm production in 2029.
smbom 2026-08-13 13:04:24
YMTC Enters Global Top Three in NAND Market
YMTC enters the global top three in NAND flash by shipments, reaching a 14% share as AI demand drives growth in enterprise SSDs and data centers.
smbom 2026-08-13 11:38:31
AT93C66B-SSHM-T: Features, Specs & More
Explore AT93C66B-SSHM-T EEPROM memory features, specifications, applications, and manufacturer details. Learn how this Microchip memory IC supports embedded designs.
smbom 2026-08-12 15:08:38
DIY Night Light: Fiber Optic Fireworks Lamp
DIY fiber optic fireworks night light with an acrylic box, optical fibers, and an old LED board for a creative home decoration project.
smbom 2026-08-12 14:29:07
What Is Transformer Parallel Operation?
Learn what transformer parallel operation is, why transformers operate in parallel, its benefits, implementation conditions, and key considerations for power systems.
smbom 2026-08-12 13:54:07
SK hynix Restarts Dalian NAND Plant Expansion
SK hynix has restarted construction of its Dalian NAND Flash plant, aiming to boost local capacity by 50% and expand production for AI-driven SSD demand.
smbom 2026-08-12 13:15:10
SK hynix Becomes Kioxia’s Top Shareholder
SK hynix has become Kioxia’s largest shareholder after Toshiba reduced its stake, strengthening its position in the global NAND flash memory market.
smbom 2026-08-12 13:04:59
TSMC CoWoS Yield Tops 98%, Targets 14x Size by 2029
TSMC’s CoWoS advanced packaging achieves over 98% yield and is set to expand to 14x reticle size by 2029, supporting next-generation AI chips.
smbom 2026-08-12 11:42:12
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