TSMC plans potential 10% wafer price hike for 2025, while CoWoS packaging could see a 20% surge, reflecting semiconductor market dynamics.

Discover a powerful DIY power bank using TP5000 and PTN04050C modules, featuring high-power LED and micro-camera integration.

Samsung and SK Hynix are transitioning to laser-based debonding for HBM4 wafers to prevent warping and enhance processing, impacting the semiconductor supply chain.

TSMC to start 2nm chip trials next week at Baoshan factory, with Apple securing initial capacity for iPhone 17 Pro, featuring advanced GAA and BSPR technologies.

Dive into our in-depth guide on the onsemi MJD2955T4G PNP Bipolar Power Transistor. Explore its key features, specifications, applications, datasheet, and benefits for your electronic projects.

Discover the latest on dual technology motion sensors—combining PIR and ultrasonic tech for precise motion detection in security and automation.

Samsung secures its first 2nm order from Japan's Preferred Networks to produce AI accelerator chips using advanced GAA and I-Cube S packaging, designed by Gaonchips.

Learn how to modify your bathroom mirror clock with R8025 for better functionality, including temperature display and touch button control.

TSMC's market cap surpasses $1 trillion, positioning it among top tech giants like Apple and Microsoft, driven by the AI boom and rising global semiconductor demand.

TSMC announces a 10% price reduction for 6/7nm nodes starting 2025, impacting semiconductor industry dynamics and client agreements.