Samsung Electronics restarts semiconductor R&D, focusing on next-gen NAND, GaN/SiC compound semiconductors, and advanced packaging for AI and memory growth.

TSMC CoWoS capacity remains tight as SK hynix explores Intel EMIB for AI chip integration, signaling rising competition in advanced packaging.

According to reports, TI raises prices again amid semiconductor inflation, with Taiwan analog IC makers like Silergy expected to benefit from higher pricing trends.

Explore TI SN74ALVC7804-40DL FIFO IC features, specs, and applications. Learn its uses in async memory systems and high-speed electronics design.

DIY charging case for Bluetooth earphones using basic materials like a 5V charger, magnets, and contact pins. Easy step-by-step guide.

Learn the color coding methods of Zener diodes, including voltage markings, identification techniques, and practical selection tips for electronics engineers.

Samsung faces a potential 18-day strike as labor tensions escalate, with experts warning losses up to $11.6B amid booming AI-driven chip demand.

TSMC reports April revenue as second-highest on record, driven by strong AI chip demand, HPC growth, and tight advanced packaging

AMD is absorbing TSMC 4nm and 5nm capacity freed by weaker smartphone chip demand as AI server and HPC markets continue to expand.

Explore MCIMX6Q5EYM10AC microprocessor features, specs, applications, and NXP Semiconductor insights in this expert EEAT-focused technical guide.