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Toshiba and Rohm join forces in a 380B yen venture for power semiconductor production, strengthening EV technology. METI subsidy supports collaboration.

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Explore TSMC's latest financial update: November sees a 15.3% MoM dip in revenue, revealing insights into semiconductor trends and challenges.

Samsung accelerates tech prowess, orders 2.5D equipment from Japan for pivotal collaboration with NVIDIA in advanced packaging.

Explore Texas Instruments UCD90120ARGCR: Overview its power-packed features, applications, and innovation in electronic systems.