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Breaking: Micron to Cut China Staff, Halt Mobile NAND
Micron starts layoffs in China and halts future mobile NAND projects, shifting focus to AI-driven DRAM and HBM memory amid rising data center demand.
smbom 2025-08-12 14:40:42
DIY Off-Grid Solar System with MPPT Controllers
Learn how to DIY an off-grid solar system using Juyou MPPT controllers, batteries, and solar panels for efficient home power with remote monitoring features.
smbom 2025-08-12 14:03:09
SK Hynix Boosts 1c DRAM with Six-Layer EUV for High-NA EUV
SK Hynix advances 1c DRAM to six-layer EUV lithography, boosting DDR5 and HBM performance while laying the groundwork for future High-NA EUV adoption.
smbom 2025-08-12 11:50:43
Samsung's Investment in US Taylor Plant to Exceed $50 Billion
Samsung plans to invest over $50B in its Texas Taylor plant, driven by Tesla and Apple AI chip orders, boosting US semiconductor production and advanced packaging.
smbom 2025-08-12 10:08:51
MAX3160EAP+: Features, Specs & More
Discover the ADI MAX3160EAP+ single transceiver with RS-232/422/485 support. Learn about its specs, datasheet, applications, and why it's ideal for industrial communication systems.
smbom 2025-08-12 10:06:24
What Are Push Switches?
Discover what push switches are, how they work, their key features, types, and common uses across consumer electronics, automotive, industrial, and medical fields.
smbom 2025-08-12 09:56:06
Intel 18A Mass Production Reportedly Delayed Until 2026
Intel’s advanced 18A chip process faces yield challenges, pushing Panther Lake’s mass production from late 2025 to early 2026, impacting Intel’s production plans.
smbom 2025-08-12 09:40:24
DIY Security Camera Repair & Solar Upgrade
Learn how to repair your security camera by replacing faulty capacitors, improving fan connections, and upgrading to a solar-powered system for reliable use.
smbom 2025-08-12 09:39:26
Samsung Secures iPhone Image Sensor Deal
Samsung secures iPhone image sensor orders from Apple, marking a decade-long return and challenging Sony's dominance with advanced three-layer wafer tech.
smbom 2025-08-12 09:37:33
UCIe 3.0 Launch Boosts Chiplet Adoption in AI and HPC
UCIe 3.0 boosts chiplet data speeds and power efficiency, driving AI, HPC, and 5G advances with new features like runtime recalibration and modular design.
smbom 2025-08-08 17:25:28
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