Samsung will exclusively supply HBM4 memory to OpenAI for its Titan AI chip, with up to 15% of flagship HBM4 capacity allocated to the next-generation AI processor.

SMYG LIMITED share: On March 20, 2026, it marks the Spring Equinox, but Samsung and SK Hynix announce DDR5 price hikes of up to 40% amid surging AI demand.

Intel Xeon 6 is now the host CPU for NVIDIA DGX Rubin NVL8, boosting AI inference performance and efficiency across data centers, cloud, and edge workloads.

Explore the Vishay VEMT2023X01 phototransistor: key specs, features, applications, datasheet, and practical insights into automotive SMD optocoupler performance.

Learn the key differences between PCB and FPC in electronics, including materials, structure, flexibility, and applications in modern devices like smartphones and computers.

Micron reports Q2 revenue of $23.9B, nearly triple last year, driven by AI and NVIDIA GPU demand, HBM4 production, and new U.S. memory fabs expansion.

DIY a 2.5-inch USB enclosure into a 3.5-inch easy-drive cable for reliable cold backups, with step-by-step guidance, power setup tips, and read/write speed insights.

UMC, VIS, PSMC and Nexchip plan wafer price increases starting April as rising materials, equipment and energy costs trigger a new semiconductor price cycle.

According to reports, Kioxia to discontinue TSOP NAND, ending low-capacity MLC production; global MLC supply set to drop sharply in 2026, driving eMMC prices higher.

Explore the RM9001DB 4-segment LED controller by Reactor-Micro. Learn features, specs, applications, datasheet, and why it’s ideal for high-voltage LED lighting solutions.