Samsung significantly improves yield of its 10nm-class 6th-gen DRAM to 50–70%, accelerating preparations for HBM4 mass production by the end of 2025 to regain DRAM leadership.

SMYG LIMITED share: the Summer Solstice arrives with peak daylight and heat, as global tech and semiconductor markets ignite with record-breaking momentum.

SK Group and AWS will invest $5.1B to build South Korea's largest AI data center in Ulsan, starting September 2025, aiming to power AI growth with 1GW capacity.

Discover the ADI LTM8031IV#PBF ultralow noise DC/DC step-down regulator. Explore its specifications, datasheet, features, and applications in automotive and industrial electronics.

Comprehensive guide to HRC fuses: their definition, working principle, features, and applications in industrial and power systems for effective and reliable circuit protection.

Meta's in-house MTIA v2 AI chip, co-developed with Broadcom and Andes using TSMC's 5nm process, is set to enter mass production by the end of 2025.

DIY guide to upgrading the M8 electronic load tester with better voltage precision, rotary switch, and advanced calibration for accurate measurements.

Google shifts Tensor G5 chip production for Pixel 10 to TSMC's 3nm N3E process, ending its foundry reliance on Samsung and intensifying industry competition.

Tesla's AI5 FSD chip begins mass production using TSMC's advanced 3nm N3P process, offering up to 2,500 TOPS and enhanced capabilities for autonomous driving.

Discover the ADI LT4356HDE-1#TRPBF, a robust surge stopper IC ideal for automotive and battery systems. Discover its features, specifications, datasheet, and application insights.