Toshiba introduces the ThermoFlaggerTM series, featuring over-temperature detection ICs with latch and non-latch functions.

Convert your desktop smoke exhaust fan into a rechargeable version for portable soldering use—compact, cordless, and perfect for high-ceiling setups.

FUJIFILM Electronic Materials Taiwan plans to invest 15 billion Japanese yen to establish a new factory and expand existing facilities, boosting semiconductor material production and creating 50 job opportunities.

AMD's upcoming Ryzen 8000 "Granite Ridge" series processors for electronic component distributors promise improved performance and power efficiency with advanced manufacturing processes.

CPLD, a programmable logic device with high density and flexibility, has shown steady market growth and holds promising future prospects in various application domains.

Apple's upcoming MR headset, featuring dual processors manufactured by TSMC, is set to revolutionize the electronic components market and boost TSMC's performance in the second half of the year.

The PN532 Red Board, commonly owned and affordable, can be paired with software to duplicate access cards, providing a convenient solution for access control.

Apple has reserved almost 90% of TSMC's first-gen 3nm process for future iPhone, Mac, and iPad production, including the A17 Bionic chip and the M3 chip utilizing the 3nm process.

Infineon Technologies launches a new generation of EiceDRIVER™ gate driver ICs, offering high efficiency, reliability, and compact design.

SMT, utilizing SMD components, is an important manufacturing technique in the electronic industry, with steady market growth and increasing opportunities driven by IoT, AI, and automotive electronics.