Samsung Electronics introduces a groundbreaking new generation of DRAM products, including the industry's first 128GB CXL 2.0 DRAM, offering enhanced capacity and bandwidth for AI and ML applications.

Designing a compact, efficient buck converter with constant current mode, capacitor balancing, and Type-C protocol ensures reliable performance with minimal heat generation.

Apple is testing the next-gen Mac computers with M3 chips, aiming to attract customers and ensure software compatibility, expected to launch later this year or early next year.

Infineon Technologies introduces new CoolSiC power modules for traction applications, offering high efficiency, reliability, and reduced energy consumption for greener and quieter trains.

As Solid State Drives (SSDs) continue to gain popularity, the demand for Hard Disk Drives (HDDs) is expected to gradually decline due to their slower performance and higher power consumption.

BCG and Intel partner to bring customized AI solutions to electronic components distributors, leveraging Intel's AI hardware and software for Generative AI, ensuring data privacy, and improving efficiency.

New spot welder upgrade features improved MCU, EC11 encoder, MT3608 boost circuit, and efficient design for enhanced performance and usability.

Google introduces dialogue feature and English-speaking chatbot Bard, aiming to enhance search experiences and compete with AI products in the electronics component distribution industry.

Google announced new AI advancements, including the PaLM 2 language model, and introduced the high-performance A3 Virtual Machines for demanding AI models.

SSD Market Soars: Increased Shipments and Advancements in Storage Density and Cost-Effectiveness Drive Growth.