With Google releasing the Pixel Fold, Apple's absence in the foldable smartphone market may put them at a disadvantage in a potentially lucrative industry.

DIY spot welder guide: Learn to build a capacitor-based spot welder with AUIRFS8409 MOSFET, XL6012E1 chip, and optocoupler drivers for enhanced performance.

As the AI wave drives demand for HPC chips, electronic components distributors prepare for the surge in advanced packaging and testing supply chain requirements.

Onsemi, a leader in intelligent power and sensing technologies, launches the latest generation of 1200V EliteSiC Silicon Carbide (SiC) M3S devices, enabling superior energy efficiency and lower system costs.

RS-422 ICs, widely used in the electronic components industry, offer high-speed, reliable data transmission and have a promising future with increasing demand and global manufacturers.

Samsung Display's adoption of LTPO TFT technology in Galaxy S series smartphone panels may increase production costs by approximately $8, according to research estimates.

The 360Go2 sports camera's short battery life and poor heat dissipation are addressed by creating a cooling and power supply back clip, resulting in improved performance and convenience.

Foxconn and Pegatron actively expand into the Indian market, aiming to dominate Apple's product assembly with plans to assemble iPhones, AirPods, and iPads in India.

Intel plans a 10% budget cut, leading to potential 20% layoffs in the CCG and DCG departments amid challenging market conditions.

RS-485 is a widely used chip in industrial automation and control systems, with high-speed communication over long distances and strong anti-interference capabilities, and is expected to continue playing an important role in the future.