Learn how to distinguish NO and NC relay contacts with clear definitions, working principles, and simple testing methods for electronics applications.

TSMC expands U.S. advanced packaging strategy with Amkor, announcing a rare 10-year deal to strengthen Arizona-based chip manufacturing supply chain.

Apple plans to raise product prices as memory and storage chip shortages driven by AI demand push up DRAM and HBM costs and tighten global supply.

Nichicon raises aluminum capacitor prices amid rising costs and strong AI demand, with Taiwan makers Kaimei, Lelon, and Jamicon expected to follow.

Explore TMS320VC33PGE150 DSP from Texas Instruments. Learn its features, specs, applications, and why it is widely used in digital signal processing.

DIY semiconductor cooling small fan by replacing the 18650 battery with a 21700 cell to improve runtime, cooling performance, and overall efficiency.

Learn the key differences between chip inductors and chip capacitors, including function, structure, testing methods, and circuit applications.

Samsung Electronics achieves a breakthrough in vertical stacking for logic chips, demonstrating 3D transistors with 42nm gate pitch for AI and HPC applications.

TSMC, imec and ASML collaborate on 12-inch wafer 2D materials roadmap, advancing MoS2 and WSe2 FETs toward next-gen semiconductor scaling.

STMicroelectronics plans $1.5B convertible bonds to refinance 2027 debt as shares nearly double on strong AI-driven data center chip demand.