DIY PIC frequency counter tutorial shows how to measure 1Hz–50MHz with PIC16F628A, display frequency on 7-segment displays, perfect for homemade radios.

Microsoft unveils Maia 200, a 3nm AI inference chip with FP4/FP8 support and HBM3e memory, delivering higher performance per dollar for large AI models.

On this warm Laba Festival,SMYG LIMITED sends heartfelt wishes for a sweet year ahead, as the world savors tradition while embracing tech progress in AI semiconductors.

Intel stock drops 12% as AI chip demand outpaces supply. Revenue misses expectations highlight production limits and challenges in data center CPU growth.

Explore the TI TPS23750PWP Power over Ethernet PD Controller, its features, specifications, applications, datasheet, and why it's ideal for IEEE802.3af designs.

Thin film and thick film resistors differ in manufacturing, accuracy, stability, cost, and applications, making each suitable for distinct electronic design needs.

Global 8-inch wafer capacity tightens as TSMC and Samsung cut production. Surging AI IC demand and edge computing needs push foundry prices higher in 2025–2026.

Learn how to build a simple hand-wired JDM PIC programmer that powers and programs PIC16F628A MCUs via serial port, perfect for DIY electronics projects.

Samsung has denied rumors of an 80% price hike across memory products, but strong AI data center demand is tightening supply and driving DRAM and NAND prices higher into 2026.

Samsung completes HBM4E base die front-end design and moves toward 2nm process, advancing AI-focused high-bandwidth memory for data centers and AI clients.