ASUS warns PC prices may rise 25%–30% in Q2 as memory, SSD, and CPU shortages push up component costs, driving early purchasing across the global PC market.

Qualcomm strengthens its partnership with Samsung, planning 2nm chip production and expanded collaboration across SoCs, AI technologies, Galaxy devices, and wearables.

Explore the Freescale/NXP MCF51JM128VLH 32-bit ColdFire MCU. Learn specs, features, datasheet, and industrial applications for optimized embedded system designs.

Discover how to test if a chip is good with step-by-step methods, including electrical checks, functional tests, and reliability assessments to accurately identify faulty ICs.

SK Hynix plans to invest $8 billion in ASML EUV lithography systems to accelerate its 1c DRAM process and expand AI-focused memory production including HBM and DDR5.

DIY FP6296 boost converter guide covering schematic design, PCB layout, assembly, and testing for a 3V–12V step-up board powering LEDs and lithium battery applications.

STMicroelectronics begins delivering China-made 40nm STM32 MCUs produced by Hua Hong, marking a key step in building a localized supply chain for the Chinese market.

SK Hynix plans to adopt TSMC’s 3nm process for HBM4E logic dies to enhance performance as competition with Samsung intensifies in next-generation HBM for AI chips.

Explore Micron MT41K64M16TW-107 IT:J DDR3L SDRAM. Learn its key features, specifications, applications, datasheet, and why this 1Gb 933MHz memory IC suits embedded systems.

Explore the differences between ceramic and quartz resonators, including materials, frequency accuracy, stability, start-up time, structure, cost, and key electronic applications.